Divided into desktop scanning electron microscopy, vertical scanning electron microscopy (tungsten filament), cold field scanning electron microscopy. Select according to magnification.

Section grinding: section grinding at a specific location; The internal structure of composite materials, multilayer interfaces, etc.; EBSD analysis pre-processing.

Surface grinding: remove scratches and pollution caused by mechanical grinding; Remove the surface structure of the sample; The layered structure of the multilayer film cross-section was observed. EBSD analysis pre-processing.

Measurement of substrate materials and inclusions; Extraction of inclusion spectra; Identify the composition of each insert.

Fourier transform infrared microscopy

Traditional microscopy is clearly one of the most widely used analytical techniques in research, forensic science, fault analysis, life sciences and electronics. With the addition of FTIR, you get a more precise and powerful set of tools for comprehensive microscopic analysis.

It can detect and immediately characterize tiny particles, product defects, or tissue abnormalities. Infrared spectroscopy provides you with a wealth of molecular information on inorganic and organic materials. Therefore, you can easily analyze any sample type from any source.

Fourier transform infrared microscopy

In an FTIR image, each pixel consists of a complete FTIR spectrum. This spectral data can be used to render false color images, emphasizing characteristics such as the chemical structure or composition of the sample.

FTIR imaging has excellent spatial resolution and sensitivity in all measurement modes. Easily and precisely assess the uniformity of tablets, polymers or other materials or chemically characterize contamination.

The use of high-gain cameras/detectors to detect trace photons emitted by defects/failures in certain semiconductor devices.

High performance X-ray inspection

Ultrasonic microscope is the use of high-frequency ultrasonic echo material internal fine structure or defect imaging, can be plastic encapsulated integrated circuit IC, IGBT high-power modules, capacitors, and copper substrate devices for non-destructive testing.