1, different package types of test fixtures (Sockets);

2, manual/semi-automatic/automatic probe table (Wafer Prober);

3, Temperature control equipment (Heating Plate, High and Low Temperature Test Chamber);

4. Customized software development

To achieve complete temperature characterization of static/dynamic parameters.

It also provides the following services to assist customers with a full range of power semiconductor device characterization.

1, insulation test equipment, reliability test equipment;

2, failure analysis equipment and third-party testing services, such as scanning electron microscopy, ion grinding, low light microscope, etc.;

3. Production line test scheme

Test item:

1. DC I/V

2. Pulsed I/V

3. 1 kHz to 5 MHz CV

4. On-Wafer I/V

5. Thermal Test

6. Power Loss Calculation